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MC33275, NCV33275 300 mA, Low Dropout Voltage Regulator
The MC33275 series are micropower low dropout voltage regulators available in a wide variety of output voltages as well as packages, SOT-223, SOP-8, DPAK, and DFN 4x4 surface mount packages. These devices feature a very low quiescent current and are capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short circuit at the output and an internal thermal shutdown circuit. Due to the low input-to-output voltage differential and bias current specifications, these devices are ideally suited for battery powered computer, consumer, and industrial equipment where an extension of useful battery life is desirable.
Features
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LOW DROPOUT MICROPOWER VOLTAGE REGULATOR
MARKING DIAGRAMS
4 1 3 SOT-223 ST SUFFIX CASE 318E 1 8 8 1 SOIC-8 D SUFFIX CASE 751 1 275xx ALYW G AYW 275xxG G
* Low Input-to-Output Voltage Differential of 25 mV at IO = 10 mA, * * * * *
and 260 mV at IO = 300 mA Extremely Tight Line and Load Regulation Stable with Output Capacitance of only 0.33 mF for 2.5 V Output Voltage Internal Current and Thermal Limiting NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes Pb-Free Packages are Available
Applications
* Battery Powered Consumer Products * Hand-Held Instruments * Camcorders and Cameras
Vin Vout
4 1 3
DPAK-3 DT SUFFIX CASE 369A 1
275xxG ALYWW
Thermal & Anti-sat Protection Rint
1
DFN-8, 4x4 MN SUFFIX CASE 488AF
1
275xx ALYWG G
1.23 V V. Ref. 54 K GND This device contains 41 active transistors
xx = Voltage Version A = Assembly Location L = Wafer Lot Y = Year W, WW = Work Week G or G = Pb-Free Device (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.
Figure 1. Simplified Block Diagram
(c) Semiconductor Components Industries, LLC, 2005
1
December, 2005 - Rev. 15
Publication Order Number: MC33275/D
MC33275, NCV33275
PIN CONNECTIONS
GND 4 GND
4
Input GND 1 2 3 Vin GND Vout MC33275ST GND 1 2 3 VinGND Vout MC33275DT N/C
1 2 3 4
8
Pins 4 and 5 Not Connected MC33275D
MC33275MN
MAXIMUM RATINGS
Rating Input Voltage Power Dissipation and Thermal Characteristics TA = 25C Maximum Power Dissipation Case 751 (SOIC-8) D Suffix Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 318E (SOT-223) ST Suffix Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Case 369A (DPAK-3) DT Suffix Thermal Resistance, Junction-to-Air Thermal Resistance, Junction-to-Case Case 488AF (DFN-8, 4x4) MN Suffix Thermal Resistance, Junction-to-Air (with 1.0 oz PCB cu area) Thermal Resistance, Junction-to-Air (with 1.8 oz PCB cu area) Thermal Resistance, Junction-to-Case Output Current Maximum Junction Temperature Operating Ambient Temperature Range Storage Temperature Range Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) Symbol VCC Value 13 Unit Vdc
PD RqJA RqJC RqJA RqJC RqJA RqJC RqJA RqJA psi-JC* IO TJ TA Tstg ESD
Internally Limited 160 25 245 15 92 6.0 183 93 9.0 300 150 - 40 to +125 - 65 to +150 4000 400
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *"C'' ("case'') is defined as the solder-attach interface between the center of the exposed pad on the bottom of the package, and the board to which it is attached.
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C C C C C
CC CC CC CC CC
Output 7 GND 6 GND 5 N/C
Input Input Input N/C
1 2 3 4
8 7 6 5
Output N/C GND N/C
W C/W C/W C/W C/W C/W C/W C/W C/W C/W mA C C C V
MC33275, NCV33275
ELECTRICAL CHARACTERISTICS (CL = 1.0mF, TA = 25C, for min/max values TJ = -40C to +125C, Note 1)
Characteristic Output Voltage 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Line Regulation Load Regulation Dropout Voltage IO = 10 mA IO = 100 mA IO = 250 mA IO = 300 mA IO = 0 mA to 250 mA TA = 25C, Vin = [VO + 1] V Symbol VO 2.475 2.970 3.267 4.950 2.450 2.940 3.234 4.900 Regline Regload Vin - VO TJ = -40C to +125C - - - - - Vn - - 160 46 - - 65 25 115 220 260 75 100 200 400 500 - dB mVrms - - 2.50 3.00 3.30 5.00 - - - - 2.0 5.0 2.525 3.030 3.333 5.05 2.550 3.060 3.366 5.100 10 25 mV mV mV Min Typ Max Unit Vdc
Vin = [VO + 1] V, 0 < IO < 100 mA 2% Tolerance from TJ = -40 to +125C
Vin = [VO + 1] V to 12 V, IO = 250 mA, All Suffixes TA = 25C Vin = [VO + 1] V, IO = 0 mA to 250 mA, All Suffixes TA = 25C
Ripple Rejection (120 Hz)
Vin(peak-peak) = [VO + 1.5] V to [VO + 5.5] V
Output Noise Voltage CL = 1.0 mF IO = 50 mA (10 Hz to 100 kHz) CL = 200 mF CURRENT PARAMETERS Quiescent Current ON Mode Quiescent Current ON Mode SAT 2.5 V Suffix 3.0 V Suffix 3.3 V Suffix 5.0 V Suffix Current Limit THERMAL SHUTDOWN Thermal Shutdown Vin = [VO + 1] V, IO = 0 mA Vin = [VO - 0.5] V, IO = 0 mA (Note 2)
IQOn IQSAT
- - - - -
125 1100 1500 1500 1500 450
200 1500 2000 2000 2000 -
mA mA
Vin = [VO + 1] V, VO Shorted
ILIMIT
-
mA
-
-
150
-
C
1. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. 2. Quiescent Current is measured where the PNP pass transistor is in saturation. Vin = [VO - 0.5] V guarantees this condition.
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MC33275, NCV33275
DEFINITIONS Load Regulation - The change in output voltage for a change in load current at constant chip temperature. Dropout Voltage - The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential), dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Output Noise Voltage - The RMS AC voltage at the output with a constant load and no input ripple, measured over a specified frequency range. Maximum Power Dissipation - The maximum total dissipation for which the regulator will operate within specifications. Quiescent Current - Current which is used to operate the regulator chip and is not delivered to the load. Line Regulation - The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Package Power Dissipation - The maximum package power dissipation is the power dissipation level at which the junction temperature reaches its maximum value i.e. 150C. The junction temperature is rising while the difference between the input power (VCC X ICC) and the output power (Vout X Iout) is increasing. Depending on ambient temperature, it is possible to calculate the maximum power dissipation and so the maximum current as following:
T -T Pd + J A R qJA
The maximum operating junction temperature TJ is specified at 150C, if TA = 25C, then PD can be found. By neglecting the quiescent current, the maximum power dissipation can be expressed as:
I out + P D V - Vout CC
The thermal resistance of the whole circuit can be evaluated by deliberately activating the thermal shutdown of the circuit (by increasing the output current or raising the input voltage for example). Then you can calculate the power dissipation by subtracting the output power from the input power. All variables are then well known: power dissipation, thermal shutdown temperature and ambient temperature.
R qJA T -T +J A P D
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MC33275, NCV33275
7 TA = 25 C 6 CL = 0.47 mF IL = 10 mA 5 Vout = 3.3 V 4 50 3 2 1 0 0 20 40 60 80 100 120 140 160 TIME (mS) 0 Vout -50 Vin 200 OUTPUT VOLTAGE CHANGE (mV) 150 100 7 TA = 25 C 6 CL = 33 mF IL = 10 mA 5 Vout = 3.3 V 4 3 2 1 0 0 50 100 TIME (mS) 150 Vout Vin 70 60 50 40 30 20 10 0 -10 -20 200 OUTPUT VOLTAGE CHANGE (mV)
Vin , INPUT VOLTAGE (V)
-100 180 200
Figure 2. Line Transient Response
Vin , INPUT VOLTAGE (V)
Figure 3. Line Transient Response
300 200 100 LOAD CURRENT (mA) 0 -100 -200 -300 -400 CL = 1.0 mF Vout = 3.3 V -500 TA = 25 C -600 Vin = 4.3 V -700 0 50 100 150 Vout CHANGE LOAD CURRENT
1.0 0.8 OUTPUT VOLTAGE CHANGE (V) 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 200 250 300 350 -1.0 400 LOAD CURRENT (mA)
350 250 150 50 -50 -150 -250 -350 -450 -550 -650 -750 0 50 100 150 200 250 300 -0.01 0.14
OUTPUT VOLTAGE CHANGE (V)
LOAD CURRENT
0.09 0.04
Vout CHANGE
CL = 33.0 mF Vout = 3.3 V TA = 25 C Vin = 4.3 V
-0.06 -0.11 -0.16
TIME (mS)
TIME (mS)
Figure 4. Load Transient Response
Figure 5. Load Transient Response
3.5 3.0 2.5 IL = 250 mA 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) DROPOUT VOLTAGE (mV) OUTPUT VOLTAGE (V) IL = 1 mA
300 250 200 150 100 50 0 1 10 100 1000 IO, OUTPUT CURRENT (mA)
Figure 6. Output Voltage versus Input Voltage
Figure 7. Dropout Voltage versus Output Current
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MC33275, NCV33275
300 250 200 Ignd (mA) 150 100 50 0 -40 IL = 250 mA IL = 100 mA 12 10 8 6 4 IL = 100 mA IL = 10 mA 0 25 85 2 IL = 50 mA 0 0 1 2 3 4 5 6 7 8 IL = 300 mA
DROPOUT VOLTAGE (mV)
IL = 300 mA
TEMPERATURE (C)
Vin (VOLTS)
Figure 8. Dropout Voltage versus Temperature
Figure 9. Ground Pin Current versus Input Voltage
8 7 6 Ignd (mA) 5 4 3 2 1 0 -40 -20 0 20 40 60 80 IL = 50 mA 100 120 140 IL = 100 mA Vout (VOLTS) IL = 250 mA
2.5 2.495 2.49 2.485 2.48 2.475 2.47 -40 IO = 0
IO = 250 mA
0
25
85
TA (C)
TEMPERATURE (C)
Figure 10. Ground Pin Current versus Ambient Temperature
Figure 11. Output Voltage versus Ambient Temperature (Vin = Vout + 1V)
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MC33275, NCV33275
2.5 2.495 2.49 Vout (VOLTS) 2.485 2.48 2.475 2.47 2.465 -40 0 25 85 IO = 250 mA IO = 0
TEMPERATURE (C)
Figure 12. Output Voltage versus Ambient Temperature (Vin = 12 V)
70 60 50 dB 40 30 20 10 0 0.1 1 10 100 IL = 10 mA
70 60 50 IL = 1 mA dB 40 30 20 10 0 0.1 1 10 100 IL = 250 mA IL = 100 mA
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 13. Ripple Rejection
Figure 14. Ripple Rejection
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MC33275, NCV33275
APPLICATIONS INFORMATION
Vin Vou
t
Cin
Cout
LOAD
GND
Figure 15. Typical Application Circuit
ESR (ohm)
The MC33275 regulators are designed with internal current limiting and thermal shutdown making them user-friendly. Figure 15 is a typical application circuit. The output capability of the regulator is in excess of 300 mA, with a typical dropout voltage of less than 260 mV. Internal protective features include current and thermal limiting.
EXTERNAL CAPACITORS
100 Vout = 3.0 V Cout = 1.0 mF Cin = 1.0 mF 10 Stable Region 1.0
These regulators require only a 0.33 mF (or greater) capacitance between the output and ground for stability for 1.8 V, 2.5 V, 3.0 V, and 3.3 V output voltage options. Output voltage options of 5.0 V require only 0.22 mF for stability. The output capacitor must be mounted as close as possible to the MC33275. If the output capacitor must be mounted further than two centimeters away, then a larger value of output capacitor may be required for stability. A value of 0.68 mF or larger is recommended. Most type of aluminum, tantalum, or multilayer ceramic will perform adequately. Solid tantalums or appropriate multilayer ceramic capacitors are recommended for operation below 25C. An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the supply input filter with long wire lengths, more than 4 inches. This will reduce the circuit's sensitivity to the input line impedance at high frequencies. A 0.33 mF or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator's input terminals. Figure 16 shows the ESR that allows the LDO to remain stable for various load currents.
0.1 0 50 100 150 200 250 300 LOAD CURRENT (mA)
Figure 16. ESR for Vout = 3.0V Applications should be tested over all operating conditions to insure stability. THERMAL PROTECTION
Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 150C, the output is disabled. There is no hysteresis built into the thermal protection. As a result the output will appear to be oscillating during thermal limit. The output will turn off until the temperature drops below the 150C then the output turns on again. The process will repeat if the junction increases above the threshold. This will continue until the existing conditions allow the junction to operate below the temperature threshold.
Thermal limit is not a substitute for proper heatsinking.
The internal current limit will typically limit current to 450 mA. If during current limit the junction exceeds 150C, the thermal protection will protect the device also. Current limit is not a substitute for proper heatsinking.
OUTPUT NOISE
In many applications it is desirable to reduce the noise present at the output. Reducing the regulator bandwidth by increasing the size of the output capacitor will reduce the noise.
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MC33275, NCV33275
180 RqJA, THERMAL RESISTANCE, JUNCTION-TO-AIR (CW) 160 140 120 100 80 RqJA 60 0 5.0 Minimum Size Pad 1.6 PD(max) for TA = 50C 2.0 oz. Copper L L 1.4 1.2 1.0 0.8 0.6 0.4 30 PD, MAXIMUM POWER DISSIPATION (W) PD, MAXIMUM POWER DISSIPATION (W) PD, MAXIMUM POWER DISSIPATION (W)
10 15 20 25 L, LENGTH OF COPPER (mm)
Figure 17. SOT-223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
100 RqJA, THERMAL RESISTANCE, JUNCTION-TO-AIR (CW) 90 80 70 60 50
PD(max) for TA = 50C 1.4
Minimum Size Pad
RqJA 40 0 5.0 10 15 20
L, LENGTH OF COPPER (mm)
Figure 18. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
170 RqJA, THERMAL RESISTANCE, JUNCTION-TO-AIR (CW) 150 130 110 90 70 RqJA 50 30 0 10 PD(max) for TA = 50C
Graph Represents Symmetrical Layout 2.0 L 2.0 oz. Copper L 1.6 1.2 0.8 0.4
20
30
L, LENGTH OF COPPER (mm)
Figure 19. SOP-8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
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IIII IIII IIII IIII
2.0 oz. Copper L L
IIIIIIII IIIIIIII IIIIIIII
III III III
25 3.0 mm 40
1.6
1.2 1.0 0.8 0.6
0.4 30
3.2 2.8 2.4
50
MC33275, NCV33275
ORDERING INFORMATION
Device MC33275D-2.5 MC33275D-2.5G MC33275D-2.5R2 MC33275D-2.5R2G MC33275DT-2.5 MC33275DT-2.5G MC33275DT-2.5RK MC33275DT-2.5RKG MC33275MN-2.5R2G MC33275ST-2.5T3 MC33275ST-2.5T3G MC33275D-3.0 MC33275D-3.0G MC33275D-3.0R2 MC33275D-3.0R2G MC33275DT-3.0 MC33275DT-3.0G MC33275DT-3.0RK MC33275DT-3.0RKG MC33275MN-3.0R2G MC33275ST-3.0T3 MC33275ST-3.0T3G 3.0 V (Fixed Voltage) 2% Tolerance at TJ from -40C to +125C 1% Tolerance at TA = 25C 2.5 V (Fixed Voltage) VO Typ (V) Operating Temperature Range, Tolerance Case 751 751 751 751 369A 369A 369A 369A 488AF 318E 318E 751 751 751 751 369A 369A 369A 369A 488AF 318E 318E Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) DPAK DPAK (Pb-Free) DPAK DPAK (Pb-Free) DFN8 (Pb-Free) SOT-223 SOT-223 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) DPAK DPAK (Pb-Free) DPAK DPAK (Pb-Free) DFN8 (Pb-Free) SOT-223 SOT-223 (Pb-Free) Marking 27525 27525 27525 27525 27525 27525G 27525 27525G 27525 27525 27525 27530 27530 27530 27530 27530 27530G 27530 27530G 27530 27530 27530 Shipping 98 Units/Rail 98 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 75 Units/Rail 75 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 3000/Tape & Reel 4000/Tape & Reel 4000/Tape & Reel 98 Units/Rail 98 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 75 Units/Rail 75 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 3000/Tape & Reel 4000/Tape & Reel 4000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC33275, NCV33275
ORDERING INFORMATION (continued)
Device MC33275D-3.3 MC33275D-3.3G MC33275D-3.3R2 MC33275D-3.3R2G MC33275DT-3.3 MC33275DT-3.3G MC33275DT-3.3RK MC33275DT-3.3RKG MC33275ST-3.3T3 MC33275ST-3.3T3G MC33275MN-3.3R2G MC33275D-5.0 MC33275D-5.0G MC33275D-5.0R2 MC33275D-5.0R2G MC33275DT-5.0 MC33275DT-5.0G MC33275DT-5.0RK MC33275DT-5.0RKG MC33275MN-5.0R2 MC33275MN-5.0R2G MC33275ST-5.0T3 MC33275ST-5.0T3G NCV33275ST-5.0T3 NCV33275ST-5.0T3G 5.0 V (Fixed Voltage) 2% Tolerance at TJ from -40C to +125C 1% Tolerance at TA = 25C 1% Tolerance at TA = 25C 3.3 V (Fixed Voltage) VO Typ (V) Operating Temperature Range, Tolerance Case 751 751 751 751 369A 369A 369A 369A 318E 318E 488AF 751 751 751 751 369A 369A 369A 369A 488AF 488AF 318E 318E 318E 318E Package SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) DPAK DPAK (Pb-Free) DPAK DPAK (Pb-Free) SOT-223 SOT-223 (Pb-Free) DFN-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) SOIC-8 SOIC-8 (Pb-Free) DPAK DPAK (Pb-Free) DPAK DPAK (Pb-Free) DFN-8 DFN-8 (Pb-Free) SOT-223 SOT-223 (Pb-Free) SOT-223 SOT-223 (Pb-Free) Marking 27533 27533 27533 27533 27533 27533G 27533 27533G 27533 27533 27330 27550 27550 27550 27550 27550 27550G 27550 27550G 27550 27550 27550 27550 27550 27550 Shipping 98 Units/Rail 98 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 75 Units/Rail 75 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 4000/Tape & Reel 4000/Tape & Reel 3000/Tape & Reel 98 Units/Rail 98 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 75 Units/Rail 75 Units/Rail 2500/Tape & Reel 2500/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 4000/Tape & Reel 4000/Tape & Reel 4000/Tape & Reel 4000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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MC33275, NCV33275
PACKAGE DIMENSIONS
SOT-223 (TO-261) ST SUFFIX CASE 318E-04 ISSUE K
A F
4
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
S
1 2 3
B
D L G J C 0.08 (0003) H M K
INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287
MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30
SOLDERING FOOTPRINT*
3.8 0.15 2.0 0.079
2.3 0.091
2.3 0.091
6.3 0.248
2.0 0.079 1.5 0.059
mm inches
SCALE 6:1
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC33275, NCV33275
PACKAGE DIMENSIONS
SOIC-8 NB D SUFFIX CASE 751-07 ISSUE AG
-X- A
8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC33275, NCV33275
PACKAGE DIMENSIONS
8 PIN DFN, 4x4 MN SUFFIX CASE 488AF-01 ISSUE B
A
8X NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.25 0.35 4.00 BSC 1.91 2.21 4.00 BSC 2.09 2.39 0.80 BSC 0.20 --- 0.30 0.50
D
PIN ONE IDENTIFICATION
L
1
B
8X
K
8
E
2X
0.15 C b
2X 8X NOTE 3
5
0.15 C
TOP VIEW
0.10 C A B 0.05 C
BOTTOM VIEW
0.10 C A
8X
0.08 C
SEATING PLANE
A1
(A3)
SIDE VIEW
C
SOLDERING FOOTPRINT*
4.30 2.21
8X
1
8X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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CC CC CC CC CC CC
CC C CC C CC C CC C CC C
4
D2
E2
e
DIM A A1 A3 b D D2 E E2 e K L
CC CC CC CC CC CC
CCC CC
2.39
0.63
0.40 0.80 PITCH
2.75
MC33275, NCV33275
PACKAGE DIMENSIONS
DPAK-3 DT SUFFIX CASE 369A-13 ISSUE AB
-T- B V R
4 SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --- 0.030 0.050 0.138 --- MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --- 0.77 1.27 3.51 ---
C E
A S
1 2 3
Z U
K F L D G
2 PL
J H 0.13 (0.005) T
DIM A B C D E F G H J K L R S U V Z
M
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MC33275/D

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